SMD PLACEMENT

Innovation and precision are at the heart of PCB production.

From initial sketches and circuit diagrams to fully assembled SMD PCBs, state-of-the-art electronic manufacturing relies on SMD technology. To ensure the highest quality, we handle SMD placement in-house using the latest generation of SMD equipment.

Our advanced machinery is capable of processing all SMD components, from 201 to QFPs, with exceptional precision, including a 0.3 mm pitch and edge dimensions of up to 54 x 54 mm². The maximum placement area is 440 x 500 mm².

Our vapor-phase soldering technology ensures safe soldering with lead-free paste at temperatures around 230°C, minimizing thermal stress on components. Uniform heat distribution guarantees reliable soldering for BGA components, while also addressing temperature challenges in metal core printed circuit boards (e.g., aluminum boards used in high-power LED applications).

  • Versatile Placement Options: Conventional SMD and mixed placements.
  • Flexible Placement Modes: Fully automated, semi-automated, or manual placement using TEACH-In or CAD data.
  • Component Compatibility: Supports THT, SMT, Fine-pitch components with sizes ranging from 0603 to TQFP (0.3 mm pitch) and µBGA (0.5 mm pitch).
  • Reflow Soldering: Performed in a convection oven, with nitrogen support if necessary.
  • Functional Inspection: Comprehensive testing to ensure optimal performance.